Designed for PEEK, Ultem, PPSU, and other high-performance FDM polymers, this build plate glue works for nearly every filament - Nylon, ABS, PLA, PETG, PEI, PSU, and every filament we've tested so far. When you're extruding over 300ºC, remove the part as quickly as possible. You want the build plate and part to be HOT when you remove it -- high-temp materials contract extremely quickly when cooling, and parts can shatter glass in less than 30 seconds. This is why we made our carbon-fiber plates for high-temp materials. When you're extruding below 300ºC, generally you can remove the part as soon as the plate cools. With materials like PLA or PETG, it usually pops itself off the plate. If it sticks too much, you can apply water around the base of the part, which will help it release. Make sure your first layer is PERFECT -- if it is too close, even without adhesives, ABS & PETG will break and chip glass.